Description
Features
- One Plating Cell
- Ideal for precious metal plating
- Small footprint
- High/Flow/Filtration (enhanced filtration yields fewer defects)
- Increased filtration speeds shim production
- Digital microprocessor controller with easy user interface
- Repeatable processes for uniform results
- Precise control of plating thickness and thickness variation
- Ergonomically designed
- Easy process maintenance
Specifications
Substrates up to 200 mm round wafers, up to 200 mm height square or rectangular
Dimensions 580 x 815 x 1230 mm (W x D x H)
Total Solution Volume 15 to 28 liters, or app. 4 to 7.5 gallons (depending on configuration)
Heating 0.5 kW
Temperature Control +/- 1 deg. C.
Pump 1/6 HP
Filtration 1 x 10″ DOE 0.45 to 5 micron rated
Input Power 200-230 VAC, 1 Phase or 100 to 130 VAC, 1 Phase
Plating Current 25 Amps Max. , Specify Range, RPP Optional
Exhaust 3-1/2 inch OD Pipe Connection
